MATERIAL COPPER CLADDING LAYERS DRILLING

FINISH

SOLDERMASK FABRICATION TESTING

Inner layer copper cladding

Maximum cu weight planes: 10 oz
Maximum cu weight signals: 5 oz
Minimum cu weight: 1/4 oz

Outer layer copper cladding

Maximum cu weight: 10 oz
Minimum cu weight: 1/4 oz
Maximum Active Board Size: 24*36

ETCHING

Minimum conductor width: .002
Minimum feature spacing: .002

LAYER CONSTRUCTIONS / IMPEDENCE DESIGN

Minimum core thickness: .002
Minimum dielectric: .002
Impedance stack-up design and verification service
Buried and blind vias
Sequential lamination construction
Buried capacitance
Finished impedance tolerance of +/- 10%
Note: Tighter tolerances are available

LAMINATION

Maximum number of layers: 30
Maximum board thickness: .400

            Panel Thickness Tolerances
.015-.030
+/- .003
.031-.080
+/- .005
.081-.125
+/- .008
>.125
+/- 10%

Note: Tighter tolerances are available

 



© Copyright Fineline Circuits & Technology
Phone: (714) 529-2942, Fax: (714) 255-8313, email: info@finelinecircuits.com