MATERIAL COPPER CLADDING LAYERS DRILLING

FINISH

SOLDERMASK FABRICATION TESTING

DRILLING

Minimum mechanical drilled hole size: .005
Minimum slot width size: .020
 
.Unplated Plated
<.040    
+/- .001 +/- .002
.040-.093    
+/- .0015 +/- .003
.094-.257    
+/- .002 +/- .004
>.257    
+/- .003 +/- .004

Minimum distance, edge to edge, from plated hole to internal circuitry or plane:

.008
Minimum distance, edge to edge, from non-plated hole to circuitry: .010 internal / .007 external
Standard finished minimum annular ring if not specified otherwise: .001
Minimum signal pad must be larger than drilled hole diameter:
.015 internal / .012 external
Minimum plane clearance must be larger than nominal finished hole
.025
Tighter annular ring is possible with tolerance or by reducing finished annular ring requirements.
Plasma desmear + etch back available    

Finish

Maximum Hole Aspect Ratio: 12:1
(SMOBC) Solder mask over bare copper, HASL
SMOBC with OSP, Enthone Cu56, Cu106a
Immersion gold, selective or full body
Elctroless gold full body
Electrolytic gold, selective or full body
Immersion silver
Multiple surface plating available
Note: Other finishers are available.

SOLDERMASK /LEGEND

Per IPC-SM-840

Wet types: SR1000, SR1020

Photo- imageable types: (LPI)

Dry Film types: Dupont Vacrel, 8000 series

Soldermask colors: Red, Green, Blue, Black, Clear, Purple

Minimum clearance pad edge to clearance edge: LPI-.002, Dry Film-.003, Wet Mask-.005

Legend colors: White, Yellow, Black, Red, Orange

Via fill: Silver Epoxy (Thermal)

 



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