MATERIAL COPPER CLADDING LAYERS DRILLING

FINISH

SOLDERMASK FABRICATION TESTING

FABRICATION

Tolerance on overall dimensions: +/-.005

Minimum inside radius: .015

Scoring, In-board Beveling, Beveling

Countersinking, Counter-boring, Edge Milling

SHOP TOLERANCE

 

Standard

Advanced

Minimum Outer Line

.004

upto .002

Minimum Inner Line Width

.004

upto .002

Minimum Outer Space, Trace/ Trace

.004

upto .002,

Minimum Inner Space, Trace/ Trace

.004

upto .002

Minimum Outer Space, Trace/ Pad

.004

upto .002

Minimum Inner Space, Trace/ Pad

.004

upto .002

Minimum Space, PCB Edge To Conductor

.010

upto .008

Layer to Layer Registration

+/- .005

.003

Finished PCB Thickness

.005 - .125

.126 - .250

Board Thickness Tolerance

+/- 10%

+/- 5%

Dimensions Hole Location

+/- .003

+/- .003

Dimensions Fab O.D.

+/- .005

+/- .004

Fabrication Radius

+/- 5 Deg

+/- 5 Deg

Warpage (inch per inch)

.007

upto .005

Minimum Dielectric Thickness

.004

upto .0015

Minimum Number of Layers

20

30

Minimum Core Thickness

.004-.005

.002

PAD TO HOLE SIZE

 

Standard

Advanced

Drilled Hole

.018

.016

Minimum Plated Hole Size* (VIA)

 

 

(Finished)

/- .008

.006

Tolerance Plated Hole Size

+/_ .003

+/- .002

Minimum Annular Ring Outer Layer

.005

.003

Minimum Annular Ring Inner Layer

.004

.002

DRILLING

 

Standard

Advanced

Maximum Aspect Ratio

6:1

12:1

Universal Grid Tester

(UGT)

.030.020

Flying Probe Testing

Minimum Pitch: 004

Minimum Feature Size: .0015

SOLDER MASK CRITERIA  

 

Standard

Advanced

SMT Minimum Pad Spacing

008

Up to .006

Line to Minimum Space

005

Up to .003

Minimum Solder Mask Rib

004

003

SURFACES FINISHES AVAILABLE

 

Standard

Advanced

HASL Minimum Thickness

0003

Up to .0005

HASL Maximum Thickness

0015

up to .001

Electrolytic Hard Gold

0 in

call for info

Maximum Thickness

 

 

Electrolytic Soft Gold

0 in

call for info

Maximum Thickness

 

 

Electroless Gold

0 in

call for info

Maximum Thickness

 

 

Immersion Gold Thickness

- 8 in

2 8

Immersion Silver Thickness

- 5 in

3 5 in

Immersion Gold Thickness

0 - 50 in

30 - 50 in

OSP

C-Planarity=Copper Plate

C-Planarity=Copper Plate

ELECTRICAL CHARACTERISTICS

 

Standard

Advance

Impedence Tolerance

+/- 10%

+/-8%

MATERIALS AVAILABLE 

 

Standard

Advance

FR-4 Standard Multifunctional

Yes

140

FR-4 High Tg

Yes

170 180

Getek

Yes

170

ADI 408

Yes

180

Polymide

Yes

230 280

BT Epoxy

Yes

180

Cyanate Ester

Yes

250

Duroids

 

Call for information

Teflons

 

Call for information

Rogers

 

Call for information

Taconics

 

Call for information

Arlon

 

Call for information

 

 



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